Fully Automatic Wafer Feeding and Packing Line

1. The fully automatic wafer feeding and boxing line consists of a main distribution belt, a scrap handling system, a servo-fed conveyor belt, a cutting and pushing system, and a packaging machine. 2. The main distribution belt is connected to the wafer dicing machine; the baffle system straightens and separates each wafer into individual, orderly rows. 3. The scrap handling system sends these single-row wafers onto the subsequent servo-fed conveyor belt, where the spacing between wafers is eliminated. 4. The dual-channel cutting and pushing system cuts the wafer blocks into smaller fragments and then pushes the wafers onto the conveyor of the packaging machine, significantly reducing the standing space and effectively preventing the scattering of smaller wafer fragments during transfer. 5. In addition to automated packaging solutions for multiple standard wafers, we also offer single-wafer packaging and chocolate-coated wafer packaging solutions. 6. Rotary and box-type motion packaging machines can be selected according to the customer’s specific requirements. 7. The packaging machine provides various functions, such as an automatic film splicer, an automatic rejection system, an automatic detection and correction system for film offset printing, and an automatic film tension control system.

Phone:+86-532-89653206/89653208

Email:songben@qdsongben.com