Multi-piece wafer automatic feeding and boxing line

1. Starting from the wafer retrieval after the dicing machine, this automated line features a main distribution belt conveyor equipped with a scrap-handling system, a servo-driven automatic feeding belt for wafer stacking, and a pushing and cutting device that slices the wafers into smaller pieces and transfers multiple wafers to the packaging machine.

2. Rotary and box-type motion packaging machines can be selected according to the customer’s detailed requirements.

3. The packaging machine offers a variety of functions, such as an automatic film splicer, an automatic rejection system, an automatic inspection and correction system for offset printing on film, and an automatic film tension control system.

4. Feel free to contact us for customized solutions.